Intel® Silicon Photonics
Our Intel® Silicon Photonics Components portfolio offers highly reliable, volume-proven solutions for pluggable data center connectivity. Features include: 400Gbps, 800Gbps, and 1.6Tbps solutions with
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An AI Compute ASIC with Optical Attach to Enable Next
What I will share today Our journey to build the first Co-Packaged Optics (CPO) deployed in datacenter Front-End and Back-End networks using high density Silicon Photonics (SiPh) Implication of CPO
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Roadmapping the next generation of silicon photonics
We chart the generational trends in silicon photonics technology, drawing parallels from the generational definitions of CMOS technology.
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MACOM PURE DRIVE™
These high-performance parts have been leveraged in leading module and system level designs and enable highly efficient interconnect spanning both short reach and long reach applications for AI/ML,
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GlobalFoundries'' Unveils Optical Module Solution Targeting CPO
GlobalFoundries (GF) has introduced an optical module solution for co-packaged optics (CPO). According to the company, the Silicon photonics Co-packag
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Silicon Photonics Comes of Age
Recently, Marvell announced a live demo of a 6.4T 3D silicon photonics engine with 32 channels that each run at 200G electrical and optical. This engine integrates hundreds of
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Market Insights: 800G & 1.6T Silicon Photonics Optical Modules
This article answers key questions about 800G and 1.6T silicon photonics optical transceivers, covering chip architecture, packaging differences versus EML, performance trade-offs,
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Marvell Unveils 1.6T Silicon Photonics Pluggable
The device includes a silicon photonics chip, linear driver, transimpedance amplifier (TIA), embedded microcontroller, and firmware—all consolidated into a single package to streamline
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A 57.2-Gb/s PAM4 Driver for a Segmented Silicon-Photonics
ur-level pulse-amplitude modulation (PAM4) driver for silicon photonic Mach-Zehnder modulator (MZM) is pres. nted. The driver is designed in a 45-nm RF-SOI CMOS technology and consists of a pre
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GlobalFoundries accelerates adoption of co-packaged optics for
SCALE CPO solution is the industry''s first OCI MSA capable platform and built with GF''s proven silicon photonics technology MALTA, N.Y., May 04, 2026 (GLOBE NEWSWIRE) --
View moreLaser Diodes & VCSEL
High-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Silicon Photonics & CPO
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
Optical Transceivers & AOCs
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Laser Drivers & CDR
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.