NVIDIA's research team proposed an innovative solution using single-mode fiber (SMF) instead of traditional polarization-maintaining fiber (PMF), solving the polarization state drift problem intr...
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CPO packaging adopts a 2.5D integrated architecture of “chip – silicon interposer – optical engine,” with interconnect density reaching 10^4 per mm², and process complexity 3 times
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Some domains, such as pluggable transceivers, are fully mature and commercially ubiquitous, while others, like co-packaged optics and optical circuit switches, exhibit high technical
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Co-Packaged Optics (CPO) is an optoelectronic co-packaging technology that integrates an optical module (responsible for optical signal
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Then we discuss the electrical and optical models used for optical links and present an example of designing the silicon photonic link with performance analysis.
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From a serviceability and maintenance perspective, pluggable optical modules are seen as valuable. Ideally, these modules should be located close to the ASIC to minimize power
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Complete guide to optical transceivers covering 1G to 800G architecture, QSFP/OSFP form factors, silicon photonics, DSP technology, and data center deployment strategies.
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1G SFP optical modules supporting SX, LX, EX and ZX for gigabit Ethernet and enterprise networking applications.
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Rethinking the limits of AI, Lightmatter merges photonics and computing to build a future where speed, efficiency, and intelligence converge.
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High-Speed Interconnects: Backend network requires high speed 100G/200G or 800G optics to connect servers and network switches. These high bandwidth connections are essential for handling the data
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Co-Packaged Optics (CPO) is an optoelectronic co-packaging technology that integrates an optical module (responsible for optical signal transmission and reception) and a switch ASIC...
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Diagnosing and replacing a failed module within a fabric containing 50,000+ optical links presents a major operational challenge, often triggering cascading effects on job scheduling and leading to
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
23 Photonics Avenue, Techno Park, Stellenbosch, 7600, South Africa
+27 63 148 2975 | +27 63 148 2975 | [email protected]