Published by IPC (Association Connecting Electronics Industries), it defines the materials, methods, and acceptance criteria for producing high-quality soldered connections on printed circuit boards, ...
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The Service Standards & Guide contains information essential to the establishment of service to new facilities, or to remodeled or expanded facilities where load has been added.
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POLICY, PROCEDURES & STANDARDS JECT TO UPDATE AND MODIFICATION AT ANY TIME. PRINTED COPIES MAY NOT INCLUDE THE MOST UP-TO DATE STANDARDS, REFERENCES,
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J-STD-001 explained for process and quality engineers. Learn soldering materials, methods, acceptance criteria, certification programs, and implementation.
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In this type of cable installation, the selected messenger is installed and the insulated cable is pulled along the messenger on rollers and attached to the messenger using spinning wire or other means
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If you bundle fewer than 193 LP cables and the selected ampacity of the cables per Table 725.144 exceeds the marked current limit of the cable, you can use the ampacity determined from the table.
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Soldering is a common method for attaching wires to PCBs and terminals. It is also used in wire-to-wire connections during rework or repair, referred to as a splice. The article explains wires
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J-STD-001 is a standard issued by IPC that defines material and process requirements for soldered electrical and electronic assemblies.
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Each Acceptance / Rejection Criteria example contains a reference to the applicable requirement(s) from the NASA Technical Standard Series, NASA-STD-8739.x.
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Soldering is a common method for attaching wires to PCBs and
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1.1 Scope This Standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control
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IPC/WHMA-A-620 standard for cable and wire harness assemblies. Requirements, acceptance criteria, soldering, crimping, and more.
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
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Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
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