Tlaletso Global Photonics (TGO) designs and manufactures laser diodes, VCSEL, DFB lasers, laser drivers, CDR circuits, optical modulators, TIAs, co-packaged optics, silicon photonics, linear drive plu...
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Kyocera Corporation (President: Shiro Sakushima; "Kyocera") today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor packages,
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Built from Kyocera''s proprietary Fine Ceramic materials, the new core substrate is engineered for high‑density wiring and exceptional rigidity.
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By selecting the appropriate ceramic powder composition and optimizing the spraying parameters, manufacturers can achieve coatings with tailored properties to meet the requirements of various
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This report represents the combined efforts of many people in 25 organizations who participated in the ceramic powders interlaboratory comparison project. It also represents a landmark for international
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An innovative method involving the production of core-shell structured ceramic powders for application in additive manufacturing was employed. Specifically, a SiC preceramic, PSE, was
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This study employs a bimodal powder system composed of nanoscale agglomerated spherical particles and micrometer-scale irregular particles to fabricate yttria (Y 2 O 3) ceramic cores
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In powder form, the core-shell particles are in a substantially dry powder form having a moisture content of less than 2% by weight. In pellet form, shells of adjacent core-shell particles...
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To experimentally determine how this process depends on particle surface composition, particle atomic layer deposition (ALD) was used to deposit a thin film of amorphous aluminum oxide (Al 2 O 3) onto
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For the investigation, the novel core-shell particles were used, which consist of a core made of standard alumina powders (Al 2 O 3), and a shell obtained by the formation of a thin outer
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Herein, ceramic cores were prepared using traditional hot injection and vat photopolymerization 3D printing techniques using fused silica, nano-ZrO2, and Al2O3 powders as starting materials.
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
23 Photonics Avenue, Techno Park, Stellenbosch, 7600, South Africa
+27 63 148 2975 | +27 63 148 2975 | +86 138 2753 9641 | +86 138 2753 9641 | [email protected]