Quick summary: EUDR packaging requirements explained for 2026 learn what agri-food exporters must know about scope, exemptions, compliance obligations, and how to avoid disruptions to EU market access...
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In Europe, civil distribution boxes are being increasingly adopted in both urban and rural areas, driven by rapid infrastructure development and increasing electricity consumption.
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Quick summary: EUDR packaging requirements explained for 2026 learn what agri-food exporters must know about scope, exemptions, compliance obligations, and how to avoid disruptions
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From 1 January 2030, all packaging sold in the EU will have to be recyclable. Packaging recyclability will be expressed in the performance grades A, B or C; by 1 January 2038, only packaging within grades
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The EU recently signed off on new rules to reduce packaging waste and to make packaging more sustainable. Our Environment team looks at how the new rules will impact importers
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Used to house electrical or electronic switchgear, control gear and equipment necessary to supply, distribute and transform electricity. Made with materials of the highest quality, they have all
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ean Regulation on Packaging and Packaging Waste (EU 2025/40) (“Packaging Re. ulation”) was published in the Official Journal of the EU. This regulation will replace the previous Packaging.
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In this post, we describe the requirements under the Regulation and its phase-in. As discussed in this post, this complex, detailed Regulation will have an operational and financial impact
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It will cover a broad range of packaging types that are produced, imported, distributed, or used in inter-company logistics by millions of companies and citizens in the EU. Companies must
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In this article, we explain the differences between the packaging types, the legal basis for them and how some EU member states – specifically France, Austria and Spain – deal with
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If products are sold outside of the selective distribution system, the supplier may rely on several legal provisions in order to put an end to such situation (please find details below).
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
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We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
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