Tlaletso Global Photonics (TGO) designs and manufactures laser diodes, VCSEL, DFB lasers, laser drivers, CDR circuits, optical modulators, TIAs, co-packaged optics, silicon photonics, linear drive plu...
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It consists of integrated dies of NTT Electronics'' ExaSPEED 400-R DSP and Silicon photonics based Coherent Optical Sub-Assembly (COSA 2.0) in
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Coherent (NYSE: COHR) will demonstrate multiple co-packaged optics (CPO) technologies at OFC 2026 in Los Angeles on March 17, 2026. Presentations include a 6.4T
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Easier to scale up for higher performance and capacity by integrating more functions on a single chip.
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Discover the evolution from 400G to 800G and 1.6T optical modules. Learn key technologies, CPO vs pluggable, and upgrade strategies for future-ready data centers.
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A powerful showcase of silicon photonics, VCSEL, and InP-on-silicon technologies operating within a co-packaged optics architecture - advancing energy-efficient scaling for AI fabrics.
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NTT Electronics starts shipping 400G coherent co-package device (CPD) samples implemented with integration of 64Gbaud Digital Signal
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It consists of integrated dies of NTT Electronics'' ExaSPEED 400-R DSP and Silicon photonics based Coherent Optical Sub-Assembly (COSA 2.0) in a single package, which can be
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The company presented advancements across co-packaged optics (CPO), pluggable transceivers, 400G-per-lane optical links, optical circuit switching and multi-rail transport, as well as thermal
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Partnering with Pilot Photonics, the project leverages chip-scale frequency comb technology to achieve unprecedented performance in linewidth, intensity noise and wavelength stability.
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Silicon photonics is now a well-established technology and market for optical transceivers. In 2021, more than 9 million silicon photonic transceivers were shipped for datacenters.
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The InP-based demonstration features a 400G-per-lane InP modulator array, illustrating a pathway toward higher lane speeds and the scalability required for future CPO architectures.
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NTT Electronics starts shipping 400G coherent co-package device (CPD) samples implemented with integration of 64Gbaud Digital Signal Processor (DSP) die and silicon photonics
View moreHigh-power CW/pulsed laser diodes (808nm–1550nm) and VCSEL arrays for 3D sensing, LIDAR, and optical interconnects.
Co-packaged optics engines, silicon photonics ICs, and optical I/O solutions for high-density switches and AI clusters.
400G/800G QSFP-DD/OSFP modules, active optical cables, and custom optical engines for data center interconnects.
Low-jitter laser drivers, integrated CDR circuits, and linear TIAs for coherent optics and short-reach links.
We provide custom laser diodes, VCSEL arrays, DFB lasers, drivers, CDR, modulators, TIAs, co-packaged optics, silicon photonics, LPO, transceivers, and AOCs.
From prototype to mass production, our team ensures premium quality and technical support.
23 Photonics Avenue, Techno Park, Stellenbosch, 7600, South Africa
+27 63 148 2975 | +27 63 148 2975 | [email protected]